CHEMICAL GOLD FINISH - ENIG
CHEMICAL GOLD FINISH - ENIG
The circuit is successively immersed in a solution of acid +Nickel salts followed by a solution of gold. Nickel, first covering pads on a thickness of 3 microns can "block" the diffusion of gold in the copper layer.
Thickness of gold finish : 0.04 .. 0.08µm
Benefits:
. Very good solderability
. Better resistance to oxidation than chemical tin
. Good characteristic for reflow
. Well suited for fine pitch and SMD
. Best surface in most of cases
. Well suited for CMS and fine steps (BGA)
. Compatible with Wire Bonding
Disadvantages:
. Cost for volume orders
Shelf life:
. 6 to 12 months depending on conditions
Recommend
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